BS EN 60664-3-2003 低压系统内设备的绝缘配合.防污染用涂覆、灌封和模压的应用
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【英文标准名称】:Insulationcoordinationforequipmentwithinlow-voltagesystems-Useofcoating,pottingormouldingforprotectionagainstpollution
【原文标准名称】:低压系统内设备的绝缘配合.防污染用涂覆、灌封和模压的应用
【标准号】:BSEN60664-3-2003
【标准状态】:作废
【国别】:英国
【发布日期】:2003-06-09
【实施或试行日期】:2003-06-09
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Coatings;Definition;Definitions;Dimensioning;Electricappliances;Electricalengineering;Electrically-operateddevices;Insulationcoordination;Insulations;Low-voltageinstallations;Low-voltageinsulator;Measurement;Printedcircuits;Printed-circuitboards;Specification(approval);Testing
【摘要】:ThispartofIEC60664appliestoassembliesprotectedagainstpollutionbytheuseofcoating,pottingormoulding,thusallowingareductionofclearanceandcreepagedistancesasdescribedinPart1orPart5.NOTE1WhenreferenceismadetoPart1orPart5,IEC60664-1orIEC60664-5aremeant.Thisstandarddescribestherequirementsandtestproceduresfortwomethodsofprotection:-type1protectionimprovesthemicroenvironmentofthepartsundertheprotection;-type2protectionisconsideredtobesimilartosolidinsulation.Thisstandardalsoappliestoallkindsofprotectedprintedboards,includingthesurfaceofinnerlayersofmulti-layerboards,substratesandsimilarlyprotectedassemblies.Inthecaseofmulti-layerprintedboards,thedistancesthroughaninnerlayerarecoveredbytherequirementsforsolidinsulationinPart1.NOTE2Examplesofsubstratesarehybridintegratedcircuitsandthick-filmtechnology.Thisstandardrefersonlytopermanentprotection.Itdoesnotcoverassembliesthataresubjectedtomechanicaladjustmentorrepair.Theprinciplesofthisstandardareapplicabletofunctional,basic,supplementaryandreinforcedinsulation.
【中国标准分类号】:K31
【国际标准分类号】:29_080_30
【页数】:30P;A4
【正文语种】:英语
【原文标准名称】:低压系统内设备的绝缘配合.防污染用涂覆、灌封和模压的应用
【标准号】:BSEN60664-3-2003
【标准状态】:作废
【国别】:英国
【发布日期】:2003-06-09
【实施或试行日期】:2003-06-09
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Coatings;Definition;Definitions;Dimensioning;Electricappliances;Electricalengineering;Electrically-operateddevices;Insulationcoordination;Insulations;Low-voltageinstallations;Low-voltageinsulator;Measurement;Printedcircuits;Printed-circuitboards;Specification(approval);Testing
【摘要】:ThispartofIEC60664appliestoassembliesprotectedagainstpollutionbytheuseofcoating,pottingormoulding,thusallowingareductionofclearanceandcreepagedistancesasdescribedinPart1orPart5.NOTE1WhenreferenceismadetoPart1orPart5,IEC60664-1orIEC60664-5aremeant.Thisstandarddescribestherequirementsandtestproceduresfortwomethodsofprotection:-type1protectionimprovesthemicroenvironmentofthepartsundertheprotection;-type2protectionisconsideredtobesimilartosolidinsulation.Thisstandardalsoappliestoallkindsofprotectedprintedboards,includingthesurfaceofinnerlayersofmulti-layerboards,substratesandsimilarlyprotectedassemblies.Inthecaseofmulti-layerprintedboards,thedistancesthroughaninnerlayerarecoveredbytherequirementsforsolidinsulationinPart1.NOTE2Examplesofsubstratesarehybridintegratedcircuitsandthick-filmtechnology.Thisstandardrefersonlytopermanentprotection.Itdoesnotcoverassembliesthataresubjectedtomechanicaladjustmentorrepair.Theprinciplesofthisstandardareapplicabletofunctional,basic,supplementaryandreinforcedinsulation.
【中国标准分类号】:K31
【国际标准分类号】:29_080_30
【页数】:30P;A4
【正文语种】:英语
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